bsc106n025s g opti mos ?2 power-transistor features ? fast switching mosfet for smps ? optimized technology for notebook dc/dc converters ? qualified according to jedec 1 for target applications ? logic level / n-channel ? excellent gate charge x r ds(on) product (fom) ? very low on-resistance r ds(on) ? superior thermal resistance ? avalanche rated; dv/dt rated ? pb-free lead plating; rohs compliant ? halogen-free according to iec61249-2-21 maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25 c 30 a t c =100 c 30 t a =25 c, r thja =45 k/w 2) 13 pulsed drain current i d,pulse t c =25 c 3) 120 avalanche energy, single pulse e as i d =30 a, r gs =25 ? 80 mj reverse diode d v /d t d v /d t i d =30 a, v ds =24 v, d i /d t =200 a/s, t j,max =150 c 6 kv/s gate source voltage v gs 20 v power dissipation p tot t c =25 c 43 w t a =25 c, r thja =45 k/w 2) 2.8 operating and storage temperature t j , t stg -55 ... 150 c iec climatic category; din iec 68-1 55/150/56 value v ds 25 v r ds(on),max 10.6 m ? i d 30 a product summary pg-tdson-8 type package marking bsc106n025s g pg-tdson-8 106n025s rev. 1.4 page 1 2009-11-03
bsc106n025s g parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - case r thjc bottom - - 2.4 k/w top 20 thermal resistance, r thja minimal footprint - - 62 junction - ambient 6 cm 2 cooling area 2) --45 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0 v, i d =1 ma 25 - - v gate threshold voltage v gs(th) v ds = v gs , i d =20 a 1.2 1.6 2 zero gate voltage drain current i dss v ds =25 v, v gs =0 v, t j =25 c - 0.1 1 a v ds =25 v, v gs =0 v, t j =125 c - 10 100 gate-source leakage current i gss v gs =20 v, v ds =0 v - 10 100 na drain-source on-state resistance r ds(on) v gs =4.5 v, i d =15 a - 13.4 16.7 m ? v gs =10 v, i d =30 a - 8.8 10.6 gate resistance r g - 1.2 - ? transconductance g fs | v ds |>2| i d | r ds(on)max , i d =30 a 20 41 - s 3) see figure 3 1) j-std20 and jesd22 values 2) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. rev. 1.4 page 2 2009-11-03
bsc106n025s g parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss - 1030 1370 pf output capacitance c oss - 396 527 reverse transfer capacitance c rss -5278 turn-on delay time t d(on) - 3.9 5.8 ns rise time t r - 3.8 5.7 turn-off delay time t d(off) -1523 fall time t f - 3.0 4.5 gate char g e characteristics 4) gate to source charge q gs - 3.7 4.9 nc gate charge at threshold q g(th) - 1.6 2.2 gate to drain charge q gd - 2.5 3.8 switching charge q sw - 4.6 6.5 gate charge total q g - 8.3 11 gate plateau voltage v plateau - 3.6 - v gate charge total, sync. fet q g(sync) v ds =0.1 v, v gs =0 to 5 v - 7.3 10 nc output charge q oss v dd =15 v, v gs =0 v - 8.6 11 reverse diode diode continous forward current i s - - 30 a diode pulse current i s,pulse - - 120 diode forward voltage v sd v gs =0 v, i f =30 a, t j =25 c - 0.93 1.1 v reverse recovery charge q rr v r =15 v, i f = i s , d i f /d t =400 a/s - - 10 nc 4) see figure 16 for gate charge parameter definition t c =25 c values v gs =0 v, v ds =15 v, f =1 mhz v dd =15 v, v gs =10 v, i d =25 a, r g =2.7 ? v dd =15 v, i d =25 a, v gs =0 to 5 v rev. 1.4 page 3 2009-11-03
bsc106n025s g 1 power dissipation 2 drain current p tot =f( t c ) i d =f( t c ); v gs 10 v 3 safe operating area 4 max. transient thermal impedance i d =f( v ds ); t c =25 c; d =0 z thjc =f( t p ) parameter: t p parameter: d = t p / t 10 s 100 s 1 ms dc 10 3 10 2 10 1 10 0 10 2 10 1 10 0 10 -1 v ds [v] i d [a] limited by on-state resistance 1 s single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 1 10 0 10 -1 10 -2 t p [s] z thjc [k/w] 0 10 20 30 40 50 0 40 80 120 160 t c [c] p tot [w] 0 5 10 15 20 25 30 35 0 40 80 120 160 t c [c] i d [a] rev. 1.4 page 4 2009-11-03
bsc106n025s g 5 typ. output characteristics 6 typ. drain-source on resistance i d =f( v ds ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. forward transconductance i d =f( v gs ); | v ds |>2| i d | r ds(on)max g fs =f( i d ); t j =25 c parameter: t j 3.4 v 3.7 v 4 v 4.5 v 10 v 0 5 10 15 20 25 30 35 0204060 i d [a] r ds(on) [m ? ] 25 c 150 c 0 10 20 30 40 50 60 012345 v gs [v] i d [a] 0 10 20 30 40 50 60 0204060 i d [a] g fs [s] 2.8 v 3 v 3.2 v 3.4 v 3.7 v 4 v 4.5 v 10 v 0 10 20 30 40 50 60 0123 v ds [v] i d [a] rev. 1.4 page 5 2009-11-03
bsc106n025s g 9 drain-source on-state resistance 10 typ. gate threshold voltage r ds(on) =f( t j ); i d =30 a; v gs =10 v v gs(th) =f( t j ); v gs = v ds parameter: i d 11 typ. capacitances 12 forward characteristics of reverse diode c =f( v ds ); v gs =0 v; f =1 mhz i f =f( v sd ) parameter: t j typ 98 % 0 4 8 12 16 20 -60 -10 40 90 140 190 t j [c] r ds(on) [m ? ] 20 a 200 a 0 0.4 0.8 1.2 1.6 2 2.4 -60 -10 40 90 140 190 t j [c] v gs(th) [v] ciss coss crss 10 4 10 3 10 2 10 100 1000 10000 0102030 v ds [v] c [pf] 25 c 150 c 25 c, 98% 150 c, 98% 10 3 10 2 10 1 10 0 0 0.5 1 1.5 2 v sd [v] i f [a] rev. 1.4 page 6 2009-11-03
bsc106n025s g 13 avalanche characteristics 14 typ. gate charge i as =f( t av ); r gs =25 ? v gs =f( q gate ); i d =25 a pulsed parameter: t j(start) parameter: v dd 15 drain-source breakdown voltage 16 gate charge waveforms v br(dss) =f( t j ); i d =1 ma 6 v 15 v 24 v 0 2 4 6 8 10 12 0 5 10 15 20 q gate [nc] v gs [v] 20 22 24 26 28 -60 -10 40 90 140 190 t j [c] v br(dss) [v] v gs q gate v gs(th) q g(th) q gs q gd q sw q g 25 c 100 c 125 c 1 10 100 1 10 100 1000 t av [s] i av [a] rev. 1.4 page 7 2009-11-03
bsc106n025s g package outline pg-tdson-8 p-tdson-8: outline rev. 1.4 page 8 2009-11-03
bsc106n025s g package outline p-tdson-8: tape dimensions in mm rev. 1.4 page 9 2009-11-03
bsc106n025s g published by infineon technologies ag 81726 munich, germany ? 2009 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office (www.infineon.com). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev. 1.4 page 10 2009-11-03
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